Analysis on Structural Stress of 64 × 64 InSb IRFPAs with Temperature Dependent Elastic Underfill
نویسندگان
چکیده
منابع مشابه
Analysis of Structural Stress in InSb Array Detector without Underfill
Hybrid infrared focal plane arrays (IRFPAs) are more and more used in both infrared medium and long wavebands for many different applications. In order to offer more spatial resolution, larger format (2048×2048) start to be available, yet its final yield is so low that its cost is very high, and is not affordable. In this paper, basing on viscoplastic Anand’s model, the structural stress of ind...
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Based on viscoplastic Anand’s model, the structural stress of 8 8 InSb infrared focal plane array detector with underfill is systematically analyzed by finite element method, and the impacts of design parameters including indium bump diameters, heights on both Von Mises stress and its distribution are discussed in this manuscript. Simulation results show that for the given indium bump height, t...
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Basing on the temperature dependent elastic model of underfill and the Anand’s viscoplastic model of indium bumps, A three-dimension finite element model is developed to simulate the structural stress and its distribution in 32×32 InSb infrared focal plane arrays integrated with microlens arrays. To learn the stress and its distribution for large format array in a short time, a small 8×8 InSb I...
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ژورنال
عنوان ژورنال: Journal of Sensors
سال: 2014
ISSN: 1687-725X,1687-7268
DOI: 10.1155/2014/952323